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一种三维集成的毫米波全金属相控阵封装天线

2026-01-12 Hits:

Affilication of Author(s):电子科技大学

Type of Patent:发明专利

State of Patent:已授权

Authorization number:CN 117543200 B

Service Invention or Not:no

Application Date:2024-01-09

何宗锐

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Degree:Doctor of Science E-Mail: