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Closed-form impedance model for annular through-silicon via pairs in three-dimensional integration,

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Note:IET MICROWAVES ANTENNAS & PROPAGATION, vol. 9, no. 8, pp. 808-813, June 5, 2015.

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王秉中

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Degree:Doctor of Engineering Status:Professor E-Mail:

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