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Wideband impedance model for coaxial through-silicon vias in 3-D integration,

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Note:IEEE Transactions on Electron Devices, vol. 60, no. 8, pp. 2498-2504, Aug. 2013.

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王秉中

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Degree:Doctor of Engineering Status:Professor E-Mail:

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