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一种基于LTCC陶瓷介质的芯片天线

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Disigner of the Invention:肖绍球; 金大鹏; 王秉中

Note:中国发明专利，ZL2010102647910，授权日：2012.12.05。

Service Invention or Not:no

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王秉中

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Degree:Doctor of Engineering Status:Professor E-Mail:

Recommended Ph.D.Supervisor 》

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