Bing-Zhong Wang, Y. Wang, W. Yu, and R. Mittra, “A hybrid 2D ADI-FDTD subgridding scheme for modeling on-chip interconnects,” IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.
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备注:IEEE Trans. Advanced Packaging, vol.24, no.4, pp.528-533, Nov. 2001.
全部作者:R. Mittra, W. Yu, Y. Wang,Bing-Zhong Wang
是否译文:否