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Paper Publications

- H. Wang, D. Huang, et al., "STREAM: Stress and thermal aware reliability management for 3D-ICs"

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Journal:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), CCF A类期刊

Translation or Not:no

Date of Publication:2018-10-01

Date of Publication:2018-10-01

Attachments:

Pre One:- X. Guo, H. Wang, et al., "Leakage-Aware Thermal Management for Multi-Core Systems Using Piecewise Linear Model Based Predictive Control"

Next One:- H. Wang, J. Wan, et al., "A fast leakage-aware full-chip transient thermal estimation method"

王海

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