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Congratulations to L. Lai for finishing his manuscript on Prediction to Packaging Stress

2017-07-26 Hits:

Congratulations to L. Lai for finishing his manuscript on Prediction to Packaging Stress

Pre One:Welcome Dr. Peng and Qu back from CMNST annual conference!

Next One:Congratulations to J. Zeng for having his paper on Dynamics Performance of Accelerometer accepted in Microsys. Tech.

周吴

Gender:Male Education Level:With Certificate of Graduation for Doctorate Study Degree:Doctor of Engineering E-Mail:

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