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Affilication of Author(s):电子科技大学

Patent Coverage:中国大陆

School Sign:第一单位

Disigner of the Invention:Lei Bi,Wanlei Ai,Jun Qin,Longjiang Deng

Type of Patent:发明

State of Patent:专利授权

Application Number:CN202211585099.7

Authorization number:ZL202211585099.7

Number of Inventors:4

Service Invention or Not:no

Application Date:2022-12-09

Authorization Date:2024-06-19

Publication Date:2024-06-18