毕磊
Academic Honor:
2015 国家优秀青年基金获得者
Hits:
Affilication of Author(s):电子科技大学
Patent Coverage:中国大陆
School Sign:第一单位
Disigner of the Invention:Lei Bi,Zheng Peng,Tongtong Kang,Jun Qin,Longjiang Deng
Type of Patent:发明
State of Patent:专利授权
Application Number:CN202110079670.7
Authorization number:CN202110079670.7
Number of Inventors:5
Service Invention or Not:no
Application Date:2021-01-21
Authorization Date:2022-03-15
Publication Date:2021-06-08