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Paper Publications
- 2017-10-25
[181] Using dispersive delay lines and time reversal for low contrast tumour detection,
- 2017-10-25
[182] A Broadband and Electrically Small Planar Monopole Employing Metamaterial Transmission Line,
- 2017-10-25
[183] Simplified Pulse Shaping Network for Microwave Signal Focusing Based on Time Reversal,
- 2017-10-25
[184] Design of Compact, Low-Profile, Wideband, Dual-Frequency Patch Antennas Based on Complementary Co-Directional SRRs,
- 2017-10-25
[185] Optically Controlled Reconfigurable Band-Notched UWB Antenna for Cognitive Radio Applications,
- 2017-10-25
[186] A Small and Bandwidth-Extended Dipole Antenna With Non-Periodic Left-Handed Transmission Line Loading,
- 2017-10-25
[187] Numerical Modeling for High Power Microwave Propagation in Soil,
- 2017-10-25
[188] Enhanced target detection in clutter using dispersive delay lines and time reversal,
- 2017-10-25
[189] Improved self-adaptive genetic algorithm with quantum scheme for electromagnetic optimization,
- 2017-10-25
[190] Compact Surface-Wave Assisted Beam-Steerable Antenna Based on HIS,
- 2017-10-25
[191] Horizontal Dipole Located Close to Ground Plane With Bidirectional Endfire Radiation,
- 2017-10-25
[192] Nearly PML for ADE-WLP-FDTD Modeling in Two-Dimensional Dispersive Media,
- 2017-10-25
[193] Numerical Dispersion Analysis and Key Parameter Selection in Laguerre-FDTD Method,
- 2017-10-25
[194] An improved PSO algorithm and its application to UWB antenna design,
- 2017-10-25
[195] A novel wideband antenna with reconfigurable broadside and endfire patterns,
- 2017-10-25
[196] Performance improvement of optically controlled microwave switch by introducing complementary split-ring resonator,
- 2017-10-25
[197] Research on a millimeter-wave phased array with wide-angle scanning performance,
- 2017-10-25
[198] A two-dimensional nonorthogonal WLP-FDTD method for eigenvalue problems,
- 2017-10-25
[199] Design of pattern reconfigurable antennas based on a two-element dipole array model,
- 2017-10-25
[200] Wideband impedance model for coaxial through-silicon vias in 3-D integration,

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