教授
博士生导师
性别：男
毕业院校：重庆大学
学历：硕士研究生毕业
学位：理学硕士学位
在职信息：离退休人员
所在单位：材料与能源学院
学科：应用化学
材料科学与工程
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[1]
A composite of epoxy resin/copper (II) acetylacetonae as catalyst of copper addition on insulated substrate, Journal of Materials Science: Materials in Electronics,, vol. 2018: 1-6, Mar 2018.
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[2]
Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification, Surface and Coatings Technology,, vol. 2018, 333, Jan 2018.
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[3]
Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core, Composites Part B: Engineering,, vol. 2018, 138, Jan 2018.
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[4]
A comparison of typical additives for copper electroplating based on theoretical computation, Computational Materials Science,, vol. 2018, 147, Jan 2018.
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[5]
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating, Electrochimica Acta,, vol. 2018, 273, Apr 2018.
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[6]
Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process, Circuit World,, vol. 2018, 44, Apr 2018.
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[7]
Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments, Journal of The Electrochemical Society,, vol. 2018, 165, Jun 2018.
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[8]
Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation., Circuit World,, vol. 2018, 44, May 2018.
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[9]
Electric and thermal performance of poly(phenylene oxide)-based composites with synergetic modification of carbon nanotubes and nanoplatelets, Polymer Composites,, vol. 2018, 39, Feb 2018.
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[10]
Mechanism analysis of microvia filling based on multiphysics coupling, Circuit World,, vol. 2018, 44, Jan 2018.
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[11]
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole, Electrochimica Acta,, vol. 2018, 283, Jun 2018.
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[12]
Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles., Composites Part B: Engineering,, vol. 2018, 154, Aug 2018.
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[13]
Graphene-coated copper calcium titanate to improve dielectric performance of PPO-based composite., Materials Letters,, vol. 2018, 233, Sep 2018.
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[14]
Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates, Composites Part B: Engineering,, vol. 2019, 158, Jan 2019.
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[15]
Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL, Applied Surface Science, vol. 479 (2019), Feb 2019.
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[16]
Competitive Adsorption between SPS and EO/PO on Copper Surface for Accelerating Trench Filling, Journal of The Electrochemical Society,, vol. 166 (2019, Feb 2019.
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[17]
Accelerator Pre-Adsorption to Speed Up Copper Electroplating Microvia Filling, Journal of The E lectrochemical Society,, vol. 166（2019）, Feb 2019.
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[18]
surface in-situ activation for electroless deposition of robust conductive copper patterns on polyimide film, Journal of the Taiwan Institute of Chemical Engineers, vol. 97 (2019), Apr 2019.
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[19]
Nickel-nanoparticles-assisted direct copper-electroplating on polythiophene conductive polymers for PCB dielectric holes, Journal of the Taiwan Institute of Chemical Engineers, vol. 100 (2019), Mar 2019.
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[20]
A novel structured spiral planar embedded inductor: Electroless-plating NiCoP alloy on copper coil as magnetic core, Journal of Magnetism and Magnetic Materials, vol. 489 (2019, May 2019.
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