何为 (教授)

教授博士生导师

性别：男

毕业院校：重庆大学

学历：硕士研究生毕业

学位：理学硕士学位

在职信息：离退休人员

所在单位：材料与能源学院

学科：应用化学
材料科学与工程

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A composite of epoxy resin/copper (II) acetylacetonae as catalyst of copper addition on insulated substrate.Journal of Materials Science: Materials in Electronics,.2018,2018: 1-6
Enhancing adhesion performance of no-flow prepreg to form multilayer structure of printed circuit boards with plasma-induced surface modification.Surface and Coatings Technology,.2018,2018, 333
Enhancing inductance of spiral copper inductor with BaFe12O19/poly (phenylene oxide) composite as an embedded magnetic core.Composites Part B: Engineering,.2018,2018, 138
A comparison of typical additives for copper electroplating based on theoretical computation.Computational Materials Science,.2018,2018, 147
Computational analysis and experimental evidence of two typical levelers for acid copper electroplating.Electrochimica Acta,.2018,2018, 273
Effects of microstrip line fabrication and design on high-speed signal integrity transmission of PCB manufacturing process.Circuit World,.2018,2018, 44
Electrochemical Factors of Levelers on Plating Uniformity of Through-Holes: Simulation and Experiments.Journal of The Electrochemical Society,.2018,2018, 165
Improvement of plating uniformity for copper patterns of IC substrate with multi-physics coupling simulation..Circuit World,.2018,2018, 44
Electric and thermal performance of poly(phenylene oxide)-based composites with synergetic modification of carbon nanotubes and nanoplatelets.Polymer Composites,.2018,2018, 39
Mechanism analysis of microvia filling based on multiphysics coupling.Circuit World,.2018,2018, 44
Investigation of poly (1-vinyl imidazole co 1, 4-butanediol diglycidyl ether) as a leveler for copper electroplating of through-hole.Electrochimica Acta,.2018,2018, 283
Direct activation of copper electroplating on conductive composite of polythiophene surface-coated with nickel nanoparticles..Composites Part B: Engineering,.2018,2018, 154
Graphene-coated copper calcium titanate to improve dielectric performance of PPO-based composite..Materials Letters,.2018,2018, 233
Enhancing adhesion performance of sputtering Ti/Cu film on pretreated composite prepreg for stacking structure of IC substrates.Composites Part B: Engineering,.2019,2019, 158
Copper induced direct CO2 laser drilling blind hole with the aid of brown oxidation for PCB CCL.Applied Surface Science.2019,479 (2019)

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